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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6544 Issued Date : 1992.11.25 Revised Date : 2002.01.25 Page No. : 1/4
HSD882S
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HSD882S is suited for the output stage of 0.75W audio, voltage regulator, and relay driver.
Absolute Maximum Ratings
TO-92
* Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ...................................................................................... 150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ................................................................................ 750 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ......................................................................................... 40 V VCEO Collector to Emitter Voltage ...................................................................................... 30 V VEBO Emitter to Base Voltage .............................................................................................. 5 V IC Collector Current............................................................................................................... 3 A
Characteristics (Ta=25C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 fT Cob Min. 40 30 5 30 100 Typ. 90 45 Max. 1 1 0.5 2 500 Unit V V V uA uA V V Test Conditions IC=100uA, IE=0 IC=1mA, IB=0 IE=10uA, IC=0 VCB=30V, IE=0 VEB=3V, IC=0 IC=2A, IB=200mA IC=2A, IB=200mA VCE=2V, IC=20mA VCE=2V, IC=1A VCE=5V, IC=0.1A, f=100MHz VCB=10V, f=1MHz, IE=0
*Pulse Test: Pulse Width 380us, Duty Cycle2%
MHz pF
Classification of hFE
Rank Range Q 100-200 P 160-320 E 250-500
HSD882S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000 1000
Spec. No. : HE6544 Issued Date : 1992.11.25 Revised Date : 2002.01.25 Page No. : 2/4
Saturation Voltage & Collector Current
125 C
o
75 C
o
25 C
o
Saturation Voltage (mV)
75 C 100
o
hFE
100
25 C
o
hFE @ VCE=2V 10 1 10 100 1000 10000 10 1
125 C VCE(sat) @ IC=10IB
o
10
100
1000
10000
Collector Current-IC (mA)
Collector Current-IC (mA)
Saturation Voltage & Collector Current
1000 1000
Saturation Voltage & Collector Current
Saturation Voltage (mV)
75 C
o
Saturation Voltage (mV)
75 C
o
100 125 C
o
100
25 C
o
125 C
o
25 C
o
VCE(sat) @ IC=40IB 10 1 10 100 1000 10000 10 1 10 100
VCE(sat) @ IC=20IB
1000
10000
Collector Current-IC (mA)
Collector Current-IC (mA)
Saturation Voltage & Collector Current
10000
100
Capacitance & Reverse-Biased Voltage
Saturation Voltage (mV)
75 C 1000 25 C
o
o
Capacitance (pF)
Cob
125 C VBE(sat) @ IC=10IB 100 1 10 100 1000 10000
10 0.1 1 10 100
o
Collector Current-IC (mA)
Reverse-Biased Voltage (V)
HSD882S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6544 Issued Date : 1992.11.25 Revised Date : 2002.01.25 Page No. : 3/4
Cutoff Frequency & Collector Current
1000
Safe Operating Area
100 PT=1ms
Cutoff Frequency (MHz). .
Collector Current (mA)
10
PT=100ms PT=1s
1
0.1
VCE=5V
100 1 10 100 1000
0.01 1 10 100
Collector Curren (mA)
Forward Biased Voltage (V)
Power Derating
800 700
Power Dissipation-PD (mW)
600 500 400 300 200 100 0 0 50 100
o
150
200
Ambient Temperature-Ta( C)
HSD882S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
A B
1 2 3
Date Code
Spec. No. : HE6544 Issued Date : 1992.11.25 Revised Date : 2002.01.25 Page No. : 4/4
2
Marking:
H SD 882S Rank Control Code
3
C
Style: Pin 1.Emitter 2.Collector 3.Base
D
H I E F
G
1
3-Lead TO-92 Plastic Package HSMC Package Code: A
*: Typical
DIM A B C D E F
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
DIM G H I 1 2 3
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
* Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
* Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSD882S
HSMC Product Specification

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